Transcendt Phoenix Solutions (TPS) is recognised as a one-stop provider of innovative equipment connectivity solutions, software solutions, equipment automation and hardware solutions.
osTTR is designed to support a wide range of IC package sizes ranging from 4 mm x 4 mm to 20 mm x 20mm. This solution handles multiple 2D vision inspection requirements for tray to tape & reel semiconductor IC device inspection needs.
| osTTR | ||
| Auto Conversion | Yes | |
| Camera | Single | |
| Lighting | Customised Japanese Lighting | |
| Input | Standard JEDEC (20 Trays) | |
| Output | Tape and Reel | |
| Pick-up Heads | 2 | |
| Rotator | 2 | |
| Inspection Criteria | ||
| Unit Inspection | Wrong Orientation, Wrong/ Mixed Mark, Missing Mark, Mark Quality, Additional Mark, Mark Shift | |
| Package Inspection (Option) | Scratch, Chipped Off, Void, Crack, Package Size | |
| System Resolution | +/- 10 micron & +/- 22 micron | |
| Min. Detectable Defect Size | 40 micron | |
| Package Type | QFN, QFP, BGA | |
| Package Size (mm) | 4 x 4 to 23 x 23 | |
| Sealing Type | Hot Seal | |
| MTBA | > 60mins | |
| MTBF | > 200 hrs | |
| Inker | Optional | |
| UPH | Up to 3,200 | |